Product
Product
WT 5902-D40-40A15 Thermal Pad
WT5902-D40-40A15 The thermal pad has high flexibility and has adhesive power on one side, which improves the trouble of the cumbersome adhesive process of the thermal pad and the significant drop in thermal conductivity caused by the product after the adhesive, and solves the demand for vibration changes in the product structure design. It can be applied to more applications, high-frequency vibration, not easy to fall off, easy to operate and use, it is a good vertical heat conduction material between the heat source (CPU or electronic chipset) and the heat sink.
FEATURES
l Thickness range: 1.0~4.0mm
l Low density: 3.3 g/cm³
l High thermal interface performance: 4.0 W/(m·K)
l Excellent flexibility: can be perfectly embed in uneven interface
l High applicability: stable performance under -50~150℃
l Excellent flame retardant performance: meet UL94-V0 level
l Meet RoHS, REACH standard
APPLICATION
l High-Reliability electronic cooling and heating components, such as electronic devices, semiconductor memory devices, etc
l General-purpose inverter, Medical equipments, DSC
l Automotive electronics, such as on-board cameras, motor control units, automotive navigation, automotive lighting (LED)
l Laser HUD light source
l Consumer microelectronics and hand held electronic device (like mobile phone, computer, etc)
l Base station, IGBT module
