Product
Product
WT 5902-90 Thermal pad
WT 5902-90 Thermal Pad can solve the problem of tolerance changes in product structural design, and are reusable. They are a good vertical heat conduction material between the heat source (CPU or electronic chip group) and the heat sink. Easy to operate, use, and rework.
▶ Typical Application
● High- Reliability electronic cooling and heating components, such as electronic devices, semiconductor memory devices, etc.
● General-purpose inverter, Medical equipments, DSC
● Automotive electronics, such as on-board cameras, motor control units, automotive navigation, automotive lighting (LED)
● Laser HUD light source
● Consumer microelectronics and hand held electronic device (like mobile phone, computer, etc)
● Base station, IGBT module
▶ Parameter Index
Index | Test Standard | Data |
Color | / | Grey |
Thickness (mm) | ASTM D374 | 1.0~4.0 |
Thermal conductivity(W/(m·K)) | ASTM D5470 | 9.0 |
Hardness (Shore OO) | ASTM D2240 | 50 |
Volume resistivity (Ω·cm) | ASTM D257 | 1.0×1010 |
Density (g/cm³) | ASTM D792 | 3.6 |
Breakdown voltage (kV/mm) | ASTM D149 | 7 |
Temperature range (℃) | / | -50~150 |
Flame retardant rating | UL94 | V-0 |
▶ Function and Characteristics
● High thermal interface performance: 9 W/(m·K)
● High flexibility: can be perfectly embed in uneven interface
● High applicability: stable performance under -50~150℃
● Excellent flame performance: meet UL94-V0 level
● Meet ROHS, REACH standard
▶ Dimension
▶ Remarks
For the data sheet, Waermtimo reserves the right to final modification.
